The conference name change is the result of the rapidly rising adoption of chiplet-based device architectures, and the increasingly critical role packaging technology is taking in the manufacture and enablement of these advanced products. As the world’s leading semiconductor companies continue to push the edge of process technology, the industry is seeing a marked shift in device design and architectures to overcome economic and time-to-market challenges. IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference ( CHIPcon). The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |